***Laser Micro Drilling (UV/Femtosecond)

Capable of drilling holes as small as 10 µm in sapphire, ruby, ceramic, and diamond with minimal thermal damage.

***CNC Micro Milling & EDM

High-precision subtractive shaping for orifice contours, flatness, and slot geometries.

***Ultrasonic & Diamond Core Machining

For custom shapes and hard-brittle material processing (zirconia, alumina, PCD).

***Sapphire and Ruby Core Cutting & Polishing

Monocrystalline material slicing, lapping, and end-face polishing for optical-grade finishes.

***Diamond Micro-Parts Fabrication

Integration with external diamond growth labs; laser post-processing and bonding.

***Optical and SEM Inspection

Up to 1000x magnification for orifice roundness, burr-free edges, and surface smoothness.

***CMM and Air Flow Testing

Measure internal tolerance and validate functional flow rates per customer specification.

High-precision processing equipment 

Precision laser drilling machine

High-precision measuring equipment 

Technological Process

Some pictures of our factory: